Features:
Seal-glo NE series are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities. Seal-glo NE series not only have rapid curing properties, with a 1-2 minute heating duration between 120-150 as required for SMD mounting, but their fine properties enable them to be applied by both high speed dispensing and screen printing alike. We have a wide range and variety of grades to meet specific customer requirements.
KAASU ENTERPRISES
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